Numerical Analysis Of Ultra-Fine Package Assembly With SAC305-TiO2 Nano-Reinforced Lead Free Solder At Different Peak Temperature

Numerical Analysis Of Ultra-Fine Package Assembly With SAC305-TiO2 Nano-Reinforced Lead Free Solder At Different Peak Temperature

This thesis aims to determine the effect of peak temperature on the wetting region of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly and to investigate thermal strain on the intermetallic compound (IMC) layer. This study focuses on the nanoparticles...

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Bibliographic Details
Main Author: Aziz, Asyraf Hasif
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2018
Subjects:
T Technology
TJ Mechanical engineering and machinery
Online Access:http://eprints.usm.my/54333/
http://eprints.usm.my/54333/1/Numerical%20Analysis%20Of%20Ultra-Fine%20Package%20Assembly%20WITH%20SAC305-TiO2%20Nano-Reinforced%20Lead%20Free%20Solder%20At%20Different%20Peak%20Temperature_Asyraf%20Hasif%20Aziz_M4_2018.pdf

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http://eprints.usm.my/54333/
http://eprints.usm.my/54333/1/Numerical%20Analysis%20Of%20Ultra-Fine%20Package%20Assembly%20WITH%20SAC305-TiO2%20Nano-Reinforced%20Lead%20Free%20Solder%20At%20Different%20Peak%20Temperature_Asyraf%20Hasif%20Aziz_M4_2018.pdf

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