High Frequency Signaling Analysis
Of Inter-Chip Package Routing
For Multi-Chip Package

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High Frequency Signaling Analysis Of Inter-Chip Package Routing For Multi-Chip Package

Multi-Chip Package (MCP) is becoming a customary form of integration in many high performance and advanced electronic devices. The vast adoptions of this technology are mainly contributed by the advantages for instance lower power consumption, heterogeneous integration of multiple silicon process te...

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Bibliographic Details
Main Author:	Yong, Khang Choong
Format:	Thesis
Language:	English
Published:	2013
Subjects:	TK1-9971 Electrical engineering. Electronics. Nuclear engineering
Online Access:	http://eprints.usm.my/45230/ http://eprints.usm.my/45230/1/Yong%20Khang%20Choong24.pdf

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