Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
Due to the environmental concern for lead toxicity, the use of lead-free solder has been widespread in electronic packaging industries. In order for lead-free solder to replace the current lead solder, lead-free solder should have as close melting point as lead solder (1830C) and also has good wetta...
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| Format: | Thesis |
| Language: | English |
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2011
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| Online Access: | http://eprints.usm.my/43190/ http://eprints.usm.my/43190/1/ABDUL%20KARIM%20ABDUL%20WAHAB.pdf |
| _version_ | 1848879756587565056 |
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| author | Wahab, Abdul Karim Abdul |
| author_facet | Wahab, Abdul Karim Abdul |
| author_sort | Wahab, Abdul Karim Abdul |
| building | USM Institutional Repository |
| collection | Online Access |
| description | Due to the environmental concern for lead toxicity, the use of lead-free solder has been widespread in electronic packaging industries. In order for lead-free solder to replace the current lead solder, lead-free solder should have as close melting point as lead solder (1830C) and also has good wettability, excellent physical and mechanical properties. This thesis is devoted to the research and development of lead-free Sn-Bi and SAC based solder alloy for microelectronic packaging applications. A systematic study was conducted on the solders characteristics, wetting behavior, the interfacial reaction, mechanical properties and growth kinetics of solders on Cu and Ni-P substrate. |
| first_indexed | 2025-11-15T17:52:17Z |
| format | Thesis |
| id | usm-43190 |
| institution | Universiti Sains Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T17:52:17Z |
| publishDate | 2011 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | usm-431902019-04-12T05:26:38Z http://eprints.usm.my/43190/ Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders Wahab, Abdul Karim Abdul TN1-997 Mining engineering. Metallurgy Due to the environmental concern for lead toxicity, the use of lead-free solder has been widespread in electronic packaging industries. In order for lead-free solder to replace the current lead solder, lead-free solder should have as close melting point as lead solder (1830C) and also has good wettability, excellent physical and mechanical properties. This thesis is devoted to the research and development of lead-free Sn-Bi and SAC based solder alloy for microelectronic packaging applications. A systematic study was conducted on the solders characteristics, wetting behavior, the interfacial reaction, mechanical properties and growth kinetics of solders on Cu and Ni-P substrate. 2011-05 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/43190/1/ABDUL%20KARIM%20ABDUL%20WAHAB.pdf Wahab, Abdul Karim Abdul (2011) Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders. Masters thesis, Universiti Sains Malaysia. |
| spellingShingle | TN1-997 Mining engineering. Metallurgy Wahab, Abdul Karim Abdul Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders |
| title | Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders |
| title_full | Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders |
| title_fullStr | Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders |
| title_full_unstemmed | Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders |
| title_short | Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders |
| title_sort | intermetallic compound and reliability study of sac and snbi lead free solders |
| topic | TN1-997 Mining engineering. Metallurgy |
| url | http://eprints.usm.my/43190/ http://eprints.usm.my/43190/1/ABDUL%20KARIM%20ABDUL%20WAHAB.pdf |