Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications
Using pulse electrodeposition technique, nano crystalline NiFe films were deposited on conductive copper substrates, under galvanostatic mode in an ultrasonic field at different conditions such as pulse current magnitude, deposition time and ultrasonic bath temperature. As-prepared NiFe/Cu thin film...
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| Format: | Article |
| Language: | English |
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M A I K Nauka - Interperiodica
2016
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| Online Access: | http://psasir.upm.edu.my/id/eprint/53903/ http://psasir.upm.edu.my/id/eprint/53903/1/Structural%20and%20electrical%20properties%20of%20nickel%E2%80%93iron%20thin%20film%20on%20copper%20substrate%20for%20dynamic%20random%20access%20memory%20applications.pdf |
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| author | Saeed, Ayad Ruthramurthy, Balachandran Wong, Hin Yong Ong, Boon Hoong Tan, Kar Ban Yow, Ho Kwang Sreekantan, Srimala |
| author_facet | Saeed, Ayad Ruthramurthy, Balachandran Wong, Hin Yong Ong, Boon Hoong Tan, Kar Ban Yow, Ho Kwang Sreekantan, Srimala |
| author_sort | Saeed, Ayad |
| building | UPM Institutional Repository |
| collection | Online Access |
| description | Using pulse electrodeposition technique, nano crystalline NiFe films were deposited on conductive copper substrates, under galvanostatic mode in an ultrasonic field at different conditions such as pulse current magnitude, deposition time and ultrasonic bath temperature. As-prepared NiFe/Cu thin films were characterized for phase analysis, surface morphology, surface roughness and resistivity measurements. The results show that the use of ultrasonic bath at room temperature has reduced the surface roughness, resistivity, average grain size and crystallite size of NiFe/Cu thin films. The resistivity is reduced with increasing deposition current from 44.2 µΩ cm at 40 mA to 33.0 µΩ cm at 100 mA. On the other hand, a significant drop of the resistivity from 35.7 to 9.4 µΩ cm is observed if the deposition time was reduced from 5 to 3 min. |
| first_indexed | 2025-11-15T10:37:35Z |
| format | Article |
| id | upm-53903 |
| institution | Universiti Putra Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T10:37:35Z |
| publishDate | 2016 |
| publisher | M A I K Nauka - Interperiodica |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | upm-539032018-02-21T02:10:31Z http://psasir.upm.edu.my/id/eprint/53903/ Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications Saeed, Ayad Ruthramurthy, Balachandran Wong, Hin Yong Ong, Boon Hoong Tan, Kar Ban Yow, Ho Kwang Sreekantan, Srimala Using pulse electrodeposition technique, nano crystalline NiFe films were deposited on conductive copper substrates, under galvanostatic mode in an ultrasonic field at different conditions such as pulse current magnitude, deposition time and ultrasonic bath temperature. As-prepared NiFe/Cu thin films were characterized for phase analysis, surface morphology, surface roughness and resistivity measurements. The results show that the use of ultrasonic bath at room temperature has reduced the surface roughness, resistivity, average grain size and crystallite size of NiFe/Cu thin films. The resistivity is reduced with increasing deposition current from 44.2 µΩ cm at 40 mA to 33.0 µΩ cm at 100 mA. On the other hand, a significant drop of the resistivity from 35.7 to 9.4 µΩ cm is observed if the deposition time was reduced from 5 to 3 min. M A I K Nauka - Interperiodica 2016 Article PeerReviewed text en http://psasir.upm.edu.my/id/eprint/53903/1/Structural%20and%20electrical%20properties%20of%20nickel%E2%80%93iron%20thin%20film%20on%20copper%20substrate%20for%20dynamic%20random%20access%20memory%20applications.pdf Saeed, Ayad and Ruthramurthy, Balachandran and Wong, Hin Yong and Ong, Boon Hoong and Tan, Kar Ban and Yow, Ho Kwang and Sreekantan, Srimala (2016) Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications. Russian Journal of Electrochemistry, 52 (8). pp. 788-795. ISSN 1023-1935; ESSN: 1608-3342 https://link.springer.com/article/10.1134/S1023193516040121 Pulse electrodeposition; NiFe/Cu thin films; Surface morphology; Surface roughness resistivity 10.1134/S1023193516040121 |
| spellingShingle | Pulse electrodeposition; NiFe/Cu thin films; Surface morphology; Surface roughness resistivity Saeed, Ayad Ruthramurthy, Balachandran Wong, Hin Yong Ong, Boon Hoong Tan, Kar Ban Yow, Ho Kwang Sreekantan, Srimala Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications |
| title | Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications |
| title_full | Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications |
| title_fullStr | Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications |
| title_full_unstemmed | Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications |
| title_short | Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications |
| title_sort | structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications |
| topic | Pulse electrodeposition; NiFe/Cu thin films; Surface morphology; Surface roughness resistivity |
| url | http://psasir.upm.edu.my/id/eprint/53903/ http://psasir.upm.edu.my/id/eprint/53903/ http://psasir.upm.edu.my/id/eprint/53903/ http://psasir.upm.edu.my/id/eprint/53903/1/Structural%20and%20electrical%20properties%20of%20nickel%E2%80%93iron%20thin%20film%20on%20copper%20substrate%20for%20dynamic%20random%20access%20memory%20applications.pdf |