Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications

Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications

Using pulse electrodeposition technique, nano crystalline NiFe films were deposited on conductive copper substrates, under galvanostatic mode in an ultrasonic field at different conditions such as pulse current magnitude, deposition time and ultrasonic bath temperature. As-prepared NiFe/Cu thin film...

Full description

Bibliographic Details
Main Authors: Saeed, Ayad, Ruthramurthy, Balachandran, Wong, Hin Yong, Ong, Boon Hoong, Tan, Kar Ban, Yow, Ho Kwang, Sreekantan, Srimala
Format: Article
Language:English
Published: M A I K Nauka - Interperiodica 2016
Subjects:
Pulse electrodeposition; NiFe/Cu thin films; Surface morphology; Surface roughness resistivity
Online Access:http://psasir.upm.edu.my/id/eprint/53903/
http://psasir.upm.edu.my/id/eprint/53903/1/Structural%20and%20electrical%20properties%20of%20nickel%E2%80%93iron%20thin%20film%20on%20copper%20substrate%20for%20dynamic%20random%20access%20memory%20applications.pdf

Internet

http://psasir.upm.edu.my/id/eprint/53903/
http://psasir.upm.edu.my/id/eprint/53903/1/Structural%20and%20electrical%20properties%20of%20nickel%E2%80%93iron%20thin%20film%20on%20copper%20substrate%20for%20dynamic%20random%20access%20memory%20applications.pdf

Similar Items