APA (7th ed.) Citation

Saeed, A., Ruthramurthy, B., Wong, H. Y., Ong, B. H., Tan, K. B., Yow, H. K., & Sreekantan, S. (2016). Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications. M A I K Nauka - Interperiodica.

Chicago Style (17th ed.) Citation

Saeed, Ayad, Balachandran Ruthramurthy, Hin Yong Wong, Boon Hoong Ong, Kar Ban Tan, Ho Kwang Yow, and Srimala Sreekantan. Structural and Electrical Properties of Nickel–iron Thin Film on Copper Substrate for Dynamic Random Access Memory Applications. M A I K Nauka - Interperiodica, 2016.

MLA (9th ed.) Citation

Saeed, Ayad, et al. Structural and Electrical Properties of Nickel–iron Thin Film on Copper Substrate for Dynamic Random Access Memory Applications. M A I K Nauka - Interperiodica, 2016.