Bismuth addition in Sn-Ag-Cu lead-free solder

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Bismuth addition in Sn-Ag-Cu lead-free solder

Sn-Ag-Cu solder is a form of solder to replace Sn-Pb solder in electronic device soldering. Sn-Ag-Cu however, consists of various weaknesses when compared to traditional Sn-Pb solder in terms of mechanical properties and reliability. Alloying with elements such as bismuth, can be one of the methods...

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Bibliographic Details
Main Authors:	Mohamed Ariff, Azmah Hanim, As'arry, Azizan, Abdul Aziz, Nuraini
Format:	Book Section
Language:	English
Published:	Faculty of Engineering, Universiti Putra Malaysia 2024
Online Access:	http://psasir.upm.edu.my/id/eprint/116512/ http://psasir.upm.edu.my/id/eprint/116512/1/116512.pdf

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