Bismuth addition in Sn-Ag-Cu lead-free solder
Sn-Ag-Cu solder is a form of solder to replace Sn-Pb solder in electronic device soldering. Sn-Ag-Cu however, consists of various weaknesses when compared to traditional Sn-Pb solder in terms of mechanical properties and reliability. Alloying with elements such as bismuth, can be one of the methods...
| Main Authors: | , , |
|---|---|
| Format: | Book Section |
| Language: | English |
| Published: |
Faculty of Engineering, Universiti Putra Malaysia
2024
|
| Online Access: | http://psasir.upm.edu.my/id/eprint/116512/ http://psasir.upm.edu.my/id/eprint/116512/1/116512.pdf |