Bismuth addition in Sn-Ag-Cu lead-free solder
Sn-Ag-Cu solder is a form of solder to replace Sn-Pb solder in electronic device soldering. Sn-Ag-Cu however, consists of various weaknesses when compared to traditional Sn-Pb solder in terms of mechanical properties and reliability. Alloying with elements such as bismuth, can be one of the methods...
| Main Authors: | , , |
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| Format: | Book Section |
| Language: | English |
| Published: |
Faculty of Engineering, Universiti Putra Malaysia
2024
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| Online Access: | http://psasir.upm.edu.my/id/eprint/116512/ http://psasir.upm.edu.my/id/eprint/116512/1/116512.pdf |
| _version_ | 1848867021722222592 |
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| author | Mohamed Ariff, Azmah Hanim As'arry, Azizan Abdul Aziz, Nuraini |
| author_facet | Mohamed Ariff, Azmah Hanim As'arry, Azizan Abdul Aziz, Nuraini |
| author_sort | Mohamed Ariff, Azmah Hanim |
| building | UPM Institutional Repository |
| collection | Online Access |
| description | Sn-Ag-Cu solder is a form of solder to replace Sn-Pb solder in electronic device soldering. Sn-Ag-Cu however, consists of various weaknesses when compared to traditional Sn-Pb
solder in terms of mechanical properties and reliability. Alloying with elements such as bismuth, can be one of the methods to improve the solder properties. Therefore, a short review is carried out to understand the improved performance with bismuth doping in the solder melting temperature and reliability testing. |
| first_indexed | 2025-11-15T14:29:53Z |
| format | Book Section |
| id | upm-116512 |
| institution | Universiti Putra Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T14:29:53Z |
| publishDate | 2024 |
| publisher | Faculty of Engineering, Universiti Putra Malaysia |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | upm-1165122025-04-09T08:28:38Z http://psasir.upm.edu.my/id/eprint/116512/ Bismuth addition in Sn-Ag-Cu lead-free solder Mohamed Ariff, Azmah Hanim As'arry, Azizan Abdul Aziz, Nuraini Sn-Ag-Cu solder is a form of solder to replace Sn-Pb solder in electronic device soldering. Sn-Ag-Cu however, consists of various weaknesses when compared to traditional Sn-Pb solder in terms of mechanical properties and reliability. Alloying with elements such as bismuth, can be one of the methods to improve the solder properties. Therefore, a short review is carried out to understand the improved performance with bismuth doping in the solder melting temperature and reliability testing. Faculty of Engineering, Universiti Putra Malaysia 2024 Book Section PeerReviewed text en http://psasir.upm.edu.my/id/eprint/116512/1/116512.pdf Mohamed Ariff, Azmah Hanim and As'arry, Azizan and Abdul Aziz, Nuraini (2024) Bismuth addition in Sn-Ag-Cu lead-free solder. In: Advanced Engineering Materials and Composites: Properties, Fabrication, and Applications. Faculty of Engineering, Universiti Putra Malaysia, Malaysia, pp. 76-79. ISBN 9786299731528 https://spel3.upm.edu.my/max/dokumen/ICAEMC2024_Advanced_Engineering_Materials_and_Composites_ICAEMC_2024_compressed.pdf |
| spellingShingle | Mohamed Ariff, Azmah Hanim As'arry, Azizan Abdul Aziz, Nuraini Bismuth addition in Sn-Ag-Cu lead-free solder |
| title | Bismuth addition in Sn-Ag-Cu lead-free solder |
| title_full | Bismuth addition in Sn-Ag-Cu lead-free solder |
| title_fullStr | Bismuth addition in Sn-Ag-Cu lead-free solder |
| title_full_unstemmed | Bismuth addition in Sn-Ag-Cu lead-free solder |
| title_short | Bismuth addition in Sn-Ag-Cu lead-free solder |
| title_sort | bismuth addition in sn-ag-cu lead-free solder |
| url | http://psasir.upm.edu.my/id/eprint/116512/ http://psasir.upm.edu.my/id/eprint/116512/ http://psasir.upm.edu.my/id/eprint/116512/1/116512.pdf |