APA (7th ed.) Citation

Mohamed Ariff, A. H., As'arry, A., & Abdul Aziz, N. (2024). Bismuth addition in Sn-Ag-Cu lead-free solder. Faculty of Engineering, Universiti Putra Malaysia.

Chicago Style (17th ed.) Citation

Mohamed Ariff, Azmah Hanim, Azizan As'arry, and Nuraini Abdul Aziz. Bismuth Addition in Sn-Ag-Cu Lead-free Solder. Faculty of Engineering, Universiti Putra Malaysia, 2024.

MLA (9th ed.) Citation

Mohamed Ariff, Azmah Hanim, et al. Bismuth Addition in Sn-Ag-Cu Lead-free Solder. Faculty of Engineering, Universiti Putra Malaysia, 2024.