Effect of Flux onto Intermetallic Compound Formation and Growth
In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn 3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C...
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| Format: | Conference or Workshop Item |
| Language: | English |
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EDP Sciences
2016
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/14487/ http://umpir.ump.edu.my/id/eprint/14487/6/fkm-2016-aisha-effect%20of%20flux.pdf |
| _version_ | 1848819735214424064 |
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| author | Siti Rabiatull Aisha, Idris Noor, Farihan Hardinnawirda, Kahar |
| author_facet | Siti Rabiatull Aisha, Idris Noor, Farihan Hardinnawirda, Kahar |
| author_sort | Siti Rabiatull Aisha, Idris |
| building | UMP Institutional Repository |
| collection | Online Access |
| description | In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn 3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C for up to 1000 hours. Results showed that fluxes significantly affect the IMC thickness and growth. In addition, during aging, the scallop and columnar morphology of IMC changed to a more planar type for both type of flux during isothermal aging. It was observed that the growth behavior of IMC was closely related to initial soldering condition. |
| first_indexed | 2025-11-15T01:58:17Z |
| format | Conference or Workshop Item |
| id | ump-14487 |
| institution | Universiti Malaysia Pahang |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T01:58:17Z |
| publishDate | 2016 |
| publisher | EDP Sciences |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | ump-144872018-01-15T07:33:11Z http://umpir.ump.edu.my/id/eprint/14487/ Effect of Flux onto Intermetallic Compound Formation and Growth Siti Rabiatull Aisha, Idris Noor, Farihan Hardinnawirda, Kahar T Technology (General) TJ Mechanical engineering and machinery In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn 3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C for up to 1000 hours. Results showed that fluxes significantly affect the IMC thickness and growth. In addition, during aging, the scallop and columnar morphology of IMC changed to a more planar type for both type of flux during isothermal aging. It was observed that the growth behavior of IMC was closely related to initial soldering condition. EDP Sciences 2016 Conference or Workshop Item PeerReviewed application/pdf en cc_by http://umpir.ump.edu.my/id/eprint/14487/6/fkm-2016-aisha-effect%20of%20flux.pdf Siti Rabiatull Aisha, Idris and Noor, Farihan and Hardinnawirda, Kahar (2016) Effect of Flux onto Intermetallic Compound Formation and Growth. In: MATEC Web of Conferences: The 3rd International Conference on Mechanical Engineering Research (ICMER 2015) , 18-19 August 2015 , Zenith Hotel, Kuantan, Pahang, Malaysia. pp. 1-3., 74 (00034). ISSN 2261-236X (Published) http://dx.doi.org/10.1051/matecconf/20167400034 |
| spellingShingle | T Technology (General) TJ Mechanical engineering and machinery Siti Rabiatull Aisha, Idris Noor, Farihan Hardinnawirda, Kahar Effect of Flux onto Intermetallic Compound Formation and Growth |
| title | Effect of Flux onto Intermetallic Compound Formation and Growth |
| title_full | Effect of Flux onto Intermetallic Compound Formation and Growth |
| title_fullStr | Effect of Flux onto Intermetallic Compound Formation and Growth |
| title_full_unstemmed | Effect of Flux onto Intermetallic Compound Formation and Growth |
| title_short | Effect of Flux onto Intermetallic Compound Formation and Growth |
| title_sort | effect of flux onto intermetallic compound formation and growth |
| topic | T Technology (General) TJ Mechanical engineering and machinery |
| url | http://umpir.ump.edu.my/id/eprint/14487/ http://umpir.ump.edu.my/id/eprint/14487/ http://umpir.ump.edu.my/id/eprint/14487/6/fkm-2016-aisha-effect%20of%20flux.pdf |