Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes

QR Code

Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes

In electronic packaging, the reliability of the interconnection changes with the surface finish and the type of solders being used. Thermal cycling is one method of reliability assessment. In thermal cycling experiments, the strain state is simplified by soldering together regular shaped pieces of m...

Full description

Bibliographic Details
Main Authors:	Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman
Format:	Conference or Workshop Item
Language:	English English
Published:	2015
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/11780/ http://umpir.ump.edu.my/id/eprint/11780/1/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes.pdf http://umpir.ump.edu.my/id/eprint/11780/7/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes-abstract.pdf

Similar Items

Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2015)

Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2015)

Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2013)

Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2013)

Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2013)

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
by: Tai, Siew Fong
Published: (2003)

Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
by: M.A., Rabiatul Adawiyah, et al.
Published: (2018)

Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
by: Idris, Siti Rabiatull Aisha
Published: (2008)

Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
by: Binh, Duong Ngoc
Published: (2009)

Effects of Sintering Temperatures on Microstructures and Mechanical Properties of Sn4.0Ag0.5Cu1.0Ni Solder Alloy
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2016)

Bismuth addition in Sn-Ag-Cu lead-free solder
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2024)

Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)

Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)

Effect of Nickel Doping on Interfacial Reaction between Lead-free Solder and Ni-P Substrate
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)

Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
by: K., Vidyatharran, et al.
Published: (2021)

A review on mechanical properties of SnAgCu/Cu joint using laser soldering
by: Nabila, Tamar Jaya, et al.
Published: (2018)

Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
by: Dele-Afolabi, T. T., et al.
Published: (2022)

Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2014)

Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging
by: Mat Hussin, Nur Liyana, et al.
Published: (2015)

Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
by: Dele-Afolabi, Temitope T., et al.
Published: (2022)

Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish
by: M. A., Azmah Hanim, et al.
Published: (2020)

Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2020)

Synergistic effect of Pd–Au bimetallic surfaces in Au-covered Pd nanowiresstudied for ethanol oxidation
by: Cheng, F., et al.
Published: (2010)

The effect of nickel doping on SAC305 lead-free solders and EN(B)EPIG surface finish
by: Osman, Saliza Azlina, et al.
Published: (2014)

Synthesis and modelling of the mechanical properties of Ag, Au and Cu nanowires
by: Nurul Akmal, Che Lah, et al.
Published: (2019)

VIS-NIR spectral and particles distribution of Au, Ag, Cu, Al and Ni nanoparticles synthesized in distilled water using laser ablation
by: Mas Ira Syafila, Mohd Hilmi Tan, et al.
Published: (2019)

Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2023)

Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
by: Abu Hassan, Nurfazlin
Published: (2009)

Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2017)

Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering
by: Muhammad Asyraf, Abdullah, et al.
Published: (2023)

Contrasting Cu–Au and Sn–W granite metallogeny through the zircon record
by: Gardiner, Nicholas, et al.
Published: (2017)

Effect of Reflow Soldering Profile on Intermetallic Compound Formation
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2015)

Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish
by: Mohamed Anuar, Rabiatul Adawiyah, et al.
Published: (2020)

Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2016)

Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
by: Ab Ghani, Noor Asikin
Published: (2016)

Effect of nickel doping into solder alloy and its strength between SnCu-Ni/immersion gold joint
by: Zetty Akhtar, Abd Malek
Published: (2017)

The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
by: Maliessa Nabilah, Mazelan
Published: (2023)

Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg
by: M.A., Rabiatul Adawiyah, et al.
Published: (2019)

Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn-3.8Ag-0.7Cu lead-free solder and copper substrate
by: Tay, S., et al.
Published: (2013)