Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes
In electronic packaging, the reliability of the interconnection changes with the surface finish and the type of solders being used. Thermal cycling is one method of reliability assessment. In thermal cycling experiments, the strain state is simplified by soldering together regular shaped pieces of m...
| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Language: | English English |
| Published: |
2015
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/11780/ http://umpir.ump.edu.my/id/eprint/11780/1/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes.pdf http://umpir.ump.edu.my/id/eprint/11780/7/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes-abstract.pdf |
Internet
http://umpir.ump.edu.my/id/eprint/11780/http://umpir.ump.edu.my/id/eprint/11780/1/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes.pdf
http://umpir.ump.edu.my/id/eprint/11780/7/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes-abstract.pdf