Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman.
| _version_ | 1848772276700315648 |
|---|---|
| author | Bustaman, Tengku Elisa |
| author_facet | Bustaman, Tengku Elisa |
| author_sort | Bustaman, Tengku Elisa |
| building | UM Research Repository |
| collection | Online Access |
| first_indexed | 2025-11-14T13:23:57Z |
| format | Thesis |
| id | um-2859 |
| institution | University Malaya |
| institution_category | Local University |
| last_indexed | 2025-11-14T13:23:57Z |
| publishDate | 1999 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | um-28592013-07-19T04:01:54Z Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman. Bustaman, Tengku Elisa TA Engineering (General). Civil engineering (General) 1999 Thesis NonPeerReviewed application/pdf http://studentsrepo.um.edu.my/2859/1/PENDAHULUAN.pdf application/pdf http://studentsrepo.um.edu.my/2859/2/ABSTRACT.pdf application/pdf http://studentsrepo.um.edu.my/2859/3/KANDUNGAN.pdf application/pdf http://studentsrepo.um.edu.my/2859/4/BAB_1.pdf application/pdf http://studentsrepo.um.edu.my/2859/5/BAB_2.pdf application/pdf http://studentsrepo.um.edu.my/2859/6/BAB_3.pdf application/pdf http://studentsrepo.um.edu.my/2859/7/BAB_4.pdf application/pdf http://studentsrepo.um.edu.my/2859/8/BAB_5.pdf application/pdf http://studentsrepo.um.edu.my/2859/9/BIBLIOGRAFI.pdf application/pdf http://studentsrepo.um.edu.my/2859/10/LAMPIRAN.pdf http://www.pendeta.um.edu.my/uhtbin/cgisirsi/x/P01UTAMA/0/5?searchdata1="Analysis of foreign matter materials related to the die attach process of semiconductor device packaging"{245} Bustaman, Tengku Elisa (1999) Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman. Masters thesis, University of Malaya. http://studentsrepo.um.edu.my/2859/ |
| spellingShingle | TA Engineering (General). Civil engineering (General) Bustaman, Tengku Elisa Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman. |
| title | Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman. |
| title_full | Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman. |
| title_fullStr | Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman. |
| title_full_unstemmed | Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman. |
| title_short | Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman. |
| title_sort | analysis of foreign matter materials related to the die attach process of semiconductor device packaging / tengku elisa bustaman. |
| topic | TA Engineering (General). Civil engineering (General) |
| url | http://www.pendeta.um.edu.my/uhtbin/cgisirsi/x/P01UTAMA/0/5?searchdata1="Analysis of foreign matter materials related to the die attach process of semiconductor device packaging"{245} http://www.pendeta.um.edu.my/uhtbin/cgisirsi/x/P01UTAMA/0/5?searchdata1="Analysis of foreign matter materials related to the die attach process of semiconductor device packaging"{245} http://studentsrepo.um.edu.my/2859/1/PENDAHULUAN.pdf http://studentsrepo.um.edu.my/2859/2/ABSTRACT.pdf http://studentsrepo.um.edu.my/2859/3/KANDUNGAN.pdf http://studentsrepo.um.edu.my/2859/4/BAB_1.pdf http://studentsrepo.um.edu.my/2859/5/BAB_2.pdf http://studentsrepo.um.edu.my/2859/6/BAB_3.pdf http://studentsrepo.um.edu.my/2859/7/BAB_4.pdf http://studentsrepo.um.edu.my/2859/8/BAB_5.pdf http://studentsrepo.um.edu.my/2859/9/BIBLIOGRAFI.pdf http://studentsrepo.um.edu.my/2859/10/LAMPIRAN.pdf |