Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman.

Bibliographic Details
Main Author:	Bustaman, Tengku Elisa
Format:	Thesis
Published:	1999
Subjects:	TA Engineering (General). Civil engineering (General)
Online Access:	http://www.pendeta.um.edu.my/uhtbin/cgisirsi/x/P01UTAMA/0/5?searchdata1="Analysis of foreign matter materials related to the die attach process of semiconductor device packaging"{245} http://studentsrepo.um.edu.my/2859/1/PENDAHULUAN.pdf http://studentsrepo.um.edu.my/2859/2/ABSTRACT.pdf http://studentsrepo.um.edu.my/2859/3/KANDUNGAN.pdf http://studentsrepo.um.edu.my/2859/4/BAB_1.pdf http://studentsrepo.um.edu.my/2859/5/BAB_2.pdf http://studentsrepo.um.edu.my/2859/6/BAB_3.pdf http://studentsrepo.um.edu.my/2859/7/BAB_4.pdf http://studentsrepo.um.edu.my/2859/8/BAB_5.pdf http://studentsrepo.um.edu.my/2859/9/BIBLIOGRAFI.pdf http://studentsrepo.um.edu.my/2859/10/LAMPIRAN.pdf

Description
Description not available.

Similar Items