Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys / Loh Hwei Ling

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Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys / Loh Hwei Ling

The inclusion of lead within the European Union’s Restriction of Hazardous Substances list has led to a push within the microelectronics industry for a suitable non-lead solder alloy substitute with comparable mechanical and chemical properties. Tin-silver-copper (Sn-Ag-Cu) alloys with the addition...

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Bibliographic Details
Main Author:	Loh, Hwei Ling
Format:	Thesis
Published:	2019
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://studentsrepo.um.edu.my/11498/ http://studentsrepo.um.edu.my/11498/1/Loh_Hwei_Ling.jpg http://studentsrepo.um.edu.my/11498/8/loh.pdf

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