Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys / Loh Hwei Ling
The inclusion of lead within the European Union’s Restriction of Hazardous Substances list has led to a push within the microelectronics industry for a suitable non-lead solder alloy substitute with comparable mechanical and chemical properties. Tin-silver-copper (Sn-Ag-Cu) alloys with the addition...
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| Format: | Thesis |
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2019
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| Online Access: | http://studentsrepo.um.edu.my/11498/ http://studentsrepo.um.edu.my/11498/1/Loh_Hwei_Ling.jpg http://studentsrepo.um.edu.my/11498/8/loh.pdf |
