Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah
This paper presents the simulation of three dimensional numerical analysis of heat and fluid flow through chip package.
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Universiti Teknologi MARA Pulau Pinang
2011
|
| Subjects: | |
| Online Access: | https://ir.uitm.edu.my/id/eprint/8790/ |