The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan
Due to environmental concerns, lead-free solders were introduced to replace the lead-based solders in microelectronics devices technology. Although there were many lead-free solder available, the Sn-Ag-Cu was considered as the best choice. But the solder has its draw backs in terms of melting temper...
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| Format: | Article |
| Language: | English |
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Universiti Teknologi MARA, Perlis
2012
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| Online Access: | https://ir.uitm.edu.my/id/eprint/34375/ |
| _version_ | 1848808533424865280 |
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| author | Yahya, Iziana Abd Hamid, Hamidi Mayappan, Ramani |
| author_facet | Yahya, Iziana Abd Hamid, Hamidi Mayappan, Ramani |
| author_sort | Yahya, Iziana |
| building | UiTM Institutional Repository |
| collection | Online Access |
| description | Due to environmental concerns, lead-free solders were introduced to replace the lead-based solders in microelectronics devices technology. Although there were many lead-free solder available, the Sn-Ag-Cu was considered as the best choice. But the solder has its draw backs in terms of melting temperature and intermetallic formations. To improve the solder, a fourth element Zn was added into the solder and was synthesized via powder metallurgy route. This research studies the effect of 0.1wt% Zn addition on the mechanical properties and intermetallic formation on Cu substrate. For the mechanical test, the Vickers hardness (Hν), yield strength (σy) and ultimate tensile strength (σUTS) were reported. The mechanical test for Zn based composites solder shows better properties compared to un-doped counterparts. For intermetallic, the solders were melted at 250oC and aged at 150oC until 400 hours. The phases formed and its growth was studied under SEM and by energy dispersive x-ray (EDX). The addition of Zinc has improved the mechanical properties of Sn-Ag-Cu solder, while the SEM results show the presence of Cu6Sn5 and Cu3Sn intermetallics. The addition of 0.1wt% Zn has retarded the growth of the Cu3Sn intermetallic but not the total intermetallic thickness. |
| first_indexed | 2025-11-14T23:00:14Z |
| format | Article |
| id | uitm-34375 |
| institution | Universiti Teknologi MARA |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T23:00:14Z |
| publishDate | 2012 |
| publisher | Universiti Teknologi MARA, Perlis |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | uitm-343752020-09-17T02:30:40Z https://ir.uitm.edu.my/id/eprint/34375/ The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan jurnalintelek Yahya, Iziana Abd Hamid, Hamidi Mayappan, Ramani Solder and soldering Metallurgy Powder metallurgy Due to environmental concerns, lead-free solders were introduced to replace the lead-based solders in microelectronics devices technology. Although there were many lead-free solder available, the Sn-Ag-Cu was considered as the best choice. But the solder has its draw backs in terms of melting temperature and intermetallic formations. To improve the solder, a fourth element Zn was added into the solder and was synthesized via powder metallurgy route. This research studies the effect of 0.1wt% Zn addition on the mechanical properties and intermetallic formation on Cu substrate. For the mechanical test, the Vickers hardness (Hν), yield strength (σy) and ultimate tensile strength (σUTS) were reported. The mechanical test for Zn based composites solder shows better properties compared to un-doped counterparts. For intermetallic, the solders were melted at 250oC and aged at 150oC until 400 hours. The phases formed and its growth was studied under SEM and by energy dispersive x-ray (EDX). The addition of Zinc has improved the mechanical properties of Sn-Ag-Cu solder, while the SEM results show the presence of Cu6Sn5 and Cu3Sn intermetallics. The addition of 0.1wt% Zn has retarded the growth of the Cu3Sn intermetallic but not the total intermetallic thickness. Universiti Teknologi MARA, Perlis 2012-12 Article PeerReviewed text en https://ir.uitm.edu.my/id/eprint/34375/1/34375.pdf Yahya, Iziana and Abd Hamid, Hamidi and Mayappan, Ramani (2012) The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan. (2012) Jurnal Intelek <https://ir.uitm.edu.my/view/publication/Jurnal_Intelek.html>, 7 (2). pp. 9-15. ISSN 2682-9223 https://jurnalintelek.uitm.edu.my/index.php/main |
| spellingShingle | Solder and soldering Metallurgy Powder metallurgy Yahya, Iziana Abd Hamid, Hamidi Mayappan, Ramani The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan |
| title | The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan |
| title_full | The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan |
| title_fullStr | The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan |
| title_full_unstemmed | The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan |
| title_short | The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan |
| title_sort | sn-3.5ag-1.0cu-0.1zn/cu intermetallic interface under thermal aging / iziana yahya, hamidi abd hamid and ramani mayappan |
| topic | Solder and soldering Metallurgy Powder metallurgy |
| url | https://ir.uitm.edu.my/id/eprint/34375/ https://ir.uitm.edu.my/id/eprint/34375/ |