High degree of testability using full scan chain and ATPG-An industrial perspective
This study describes an efficient design methodology from an industrial perspective on utilizing Register Transfer Level (RTL) coding style, full scan chain implementation and Automatic Test Pattern Generation (ATPG) to achieve a high percentage of testability in the final Integrated Circuit (IC). T...
| Main Authors: | , , , , |
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| Format: | Citation Index Journal |
| Language: | English |
| Published: |
2009
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| Online Access: | http://scholars.utp.edu.my/id/eprint/458/ http://scholars.utp.edu.my/id/eprint/458/1/paper.pdf |
| _version_ | 1848658992150085632 |
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| author | M.B.I., Reaz W.F., Lee N.H., Hamid H.H., Lo A.Y.M., Shakaff |
| author_facet | M.B.I., Reaz W.F., Lee N.H., Hamid H.H., Lo A.Y.M., Shakaff |
| author_sort | M.B.I., Reaz |
| building | UTP Institutional Repository |
| collection | Online Access |
| description | This study describes an efficient design methodology from an industrial perspective on utilizing Register Transfer Level (RTL) coding style, full scan chain implementation and Automatic Test Pattern Generation (ATPG) to achieve a high percentage of testability in the final Integrated Circuit (IC). The design methodology involves using an ASIC design flow with scan insertion and scan stitching performed after synthesis with scan flops set as don't_use during synthesis process. Based on this method of ASIC design flow with the RTL coding style and guideline, an in-house 64 bit processor core that executes 3 instructions per cycle, is implemented with 0.35 micron process technology with a single scan chain of 4600 flip-flops, achieving an ATPG pattern for stuck-at at 100% test coverage and 99.81% fault coverage. Thus, creating high testability coverage with the ATPG pattern can be achieved by having a fully synchronous design using the proposed RTL coding style and full scan chain implementation. This study also describes the work around methods used when dealing with cost reduction involving reduction of test pin on the IC chip package. © 2009 Asian Network for Scientific Information.
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| first_indexed | 2025-11-13T07:23:20Z |
| format | Citation Index Journal |
| id | oai:scholars.utp.edu.my:458 |
| institution | Universiti Teknologi Petronas |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-13T07:23:20Z |
| publishDate | 2009 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | oai:scholars.utp.edu.my:4582017-01-19T08:25:48Z http://scholars.utp.edu.my/id/eprint/458/ High degree of testability using full scan chain and ATPG-An industrial perspective M.B.I., Reaz W.F., Lee N.H., Hamid H.H., Lo A.Y.M., Shakaff TK Electrical engineering. Electronics Nuclear engineering This study describes an efficient design methodology from an industrial perspective on utilizing Register Transfer Level (RTL) coding style, full scan chain implementation and Automatic Test Pattern Generation (ATPG) to achieve a high percentage of testability in the final Integrated Circuit (IC). The design methodology involves using an ASIC design flow with scan insertion and scan stitching performed after synthesis with scan flops set as don't_use during synthesis process. Based on this method of ASIC design flow with the RTL coding style and guideline, an in-house 64 bit processor core that executes 3 instructions per cycle, is implemented with 0.35 micron process technology with a single scan chain of 4600 flip-flops, achieving an ATPG pattern for stuck-at at 100% test coverage and 99.81% fault coverage. Thus, creating high testability coverage with the ATPG pattern can be achieved by having a fully synchronous design using the proposed RTL coding style and full scan chain implementation. This study also describes the work around methods used when dealing with cost reduction involving reduction of test pin on the IC chip package. © 2009 Asian Network for Scientific Information. 2009 Citation Index Journal NonPeerReviewed application/pdf en http://scholars.utp.edu.my/id/eprint/458/1/paper.pdf M.B.I., Reaz and W.F., Lee and N.H., Hamid and H.H., Lo and A.Y.M., Shakaff (2009) High degree of testability using full scan chain and ATPG-An industrial perspective. [Citation Index Journal] http://www.scopus.com/inward/record.url?eid=2-s2.0-67649780535&partnerID=40&md5=d139c1efbcf4357b2da71050a3b397ed 10.3923/jas.2009.2613.2618 10.3923/jas.2009.2613.2618 10.3923/jas.2009.2613.2618 |
| spellingShingle | TK Electrical engineering. Electronics Nuclear engineering M.B.I., Reaz W.F., Lee N.H., Hamid H.H., Lo A.Y.M., Shakaff High degree of testability using full scan chain and ATPG-An industrial perspective |
| title | High degree of testability using full scan chain and ATPG-An industrial perspective
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| title_full | High degree of testability using full scan chain and ATPG-An industrial perspective
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| title_fullStr | High degree of testability using full scan chain and ATPG-An industrial perspective
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| title_full_unstemmed | High degree of testability using full scan chain and ATPG-An industrial perspective
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| title_short | High degree of testability using full scan chain and ATPG-An industrial perspective
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| title_sort | high degree of testability using full scan chain and atpg-an industrial perspective |
| topic | TK Electrical engineering. Electronics Nuclear engineering |
| url | http://scholars.utp.edu.my/id/eprint/458/ http://scholars.utp.edu.my/id/eprint/458/ http://scholars.utp.edu.my/id/eprint/458/ http://scholars.utp.edu.my/id/eprint/458/1/paper.pdf |