Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue

Bibliographic Details
Main Authors: Mohd Nasir Tamin, Liew, Yek Ban
Format: Article
Language:English
Published: Penerbit UKM 2008
Online Access:http://journalarticle.ukm.my/2566/
http://journalarticle.ukm.my/2566/1/2008-9.pdf
_version_ 1848809909981806592
author Mohd Nasir Tamin,
Liew, Yek Ban
author_facet Mohd Nasir Tamin,
Liew, Yek Ban
author_sort Mohd Nasir Tamin,
building UKM Institutional Repository
collection Online Access
first_indexed 2025-11-14T23:22:07Z
format Article
id oai:generic.eprints.org:2566
institution Universiti Kebangasaan Malaysia
institution_category Local University
language English
last_indexed 2025-11-14T23:22:07Z
publishDate 2008
publisher Penerbit UKM
recordtype eprints
repository_type Digital Repository
spelling oai:generic.eprints.org:25662016-12-14T06:31:59Z http://journalarticle.ukm.my/2566/ Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue Mohd Nasir Tamin, Liew, Yek Ban Penerbit UKM 2008 Article PeerReviewed application/pdf en http://journalarticle.ukm.my/2566/1/2008-9.pdf Mohd Nasir Tamin, and Liew, Yek Ban (2008) Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue. Jurnal Kejuruteraan, 20 . pp. 95-106. http://www.ukm.my/jkukm/index.php/jkukm
spellingShingle Mohd Nasir Tamin,
Liew, Yek Ban
Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue
title Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue
title_full Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue
title_fullStr Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue
title_full_unstemmed Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue
title_short Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue
title_sort numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue
url http://journalarticle.ukm.my/2566/
http://journalarticle.ukm.my/2566/
http://journalarticle.ukm.my/2566/1/2008-9.pdf