Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue
| Main Authors: | , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Penerbit UKM
2008
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| Online Access: | http://journalarticle.ukm.my/2566/ http://journalarticle.ukm.my/2566/1/2008-9.pdf |