Effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach
Hardness properties of SAC305 solder wire under tensile test at varied temperature was investigated. Continuous multicycle (CMC) nanoindentation technique with ten cycle of indentation for each sample was performed to evaluate the hardness behaviour of SAC305 solder wire at different depth of inden...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit Universiti Kebangsaan Malaysia
2020
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| Online Access: | http://journalarticle.ukm.my/16172/ http://journalarticle.ukm.my/16172/1/19.pdf |
| _version_ | 1848813984686276608 |
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| author | Norliza Ismail, Maria Abu Bakar, Saiful Bahari Bakarudin, |
| author_facet | Norliza Ismail, Maria Abu Bakar, Saiful Bahari Bakarudin, |
| author_sort | Norliza Ismail, |
| building | UKM Institutional Repository |
| collection | Online Access |
| description | Hardness properties of SAC305 solder wire under tensile test at varied temperature was investigated. Continuous multicycle (CMC) nanoindentation technique with ten cycle of indentation for each sample was performed to evaluate the
hardness behaviour of SAC305 solder wire at different depth of indentation. As a result, all investigated SAC305 solder
wire under constant strain rate of tensile test and at different temperature revealed the occurrence of indentation size
effect (ISE). At initial cycle of indentation, SAC305 solder wire at room temperature (25 °C) have higher hardness
value compared to the others sample which exposed to the varied temperature during tensile test. Besides, higher
temperature causes the higher strain or elongation to the SAC305 solder wire. Applied of strain during the tensile
test had generated the pre-dislocation activity in the SAC305 solder wire. Therefore, higher hardness values of SAC305
at room temperature is due to the existence of high dislocation density induced by the applied strain. Nevertheless, the
existence of heat at 60, 90, 120 and 180 °C during the tensile test prompt the rearrangement of dislocation and reduce
the dislocation activities, thus, allowing higher elongation of solder wire. |
| first_indexed | 2025-11-15T00:26:52Z |
| format | Article |
| id | oai:generic.eprints.org:16172 |
| institution | Universiti Kebangasaan Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T00:26:52Z |
| publishDate | 2020 |
| publisher | Penerbit Universiti Kebangsaan Malaysia |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | oai:generic.eprints.org:161722021-02-13T13:31:07Z http://journalarticle.ukm.my/16172/ Effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach Norliza Ismail, Maria Abu Bakar, Saiful Bahari Bakarudin, Hardness properties of SAC305 solder wire under tensile test at varied temperature was investigated. Continuous multicycle (CMC) nanoindentation technique with ten cycle of indentation for each sample was performed to evaluate the hardness behaviour of SAC305 solder wire at different depth of indentation. As a result, all investigated SAC305 solder wire under constant strain rate of tensile test and at different temperature revealed the occurrence of indentation size effect (ISE). At initial cycle of indentation, SAC305 solder wire at room temperature (25 °C) have higher hardness value compared to the others sample which exposed to the varied temperature during tensile test. Besides, higher temperature causes the higher strain or elongation to the SAC305 solder wire. Applied of strain during the tensile test had generated the pre-dislocation activity in the SAC305 solder wire. Therefore, higher hardness values of SAC305 at room temperature is due to the existence of high dislocation density induced by the applied strain. Nevertheless, the existence of heat at 60, 90, 120 and 180 °C during the tensile test prompt the rearrangement of dislocation and reduce the dislocation activities, thus, allowing higher elongation of solder wire. Penerbit Universiti Kebangsaan Malaysia 2020-12 Article PeerReviewed application/pdf en http://journalarticle.ukm.my/16172/1/19.pdf Norliza Ismail, and Maria Abu Bakar, and Saiful Bahari Bakarudin, (2020) Effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach. Sains Malaysiana, 49 (12). pp. 3073-3080. ISSN 0126-6039 https://www.ukm.my/jsm/malay_journals/jilid49bil12_2020/KandunganJilid49Bil12_2020.html |
| spellingShingle | Norliza Ismail, Maria Abu Bakar, Saiful Bahari Bakarudin, Effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach |
| title | Effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach |
| title_full | Effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach |
| title_fullStr | Effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach |
| title_full_unstemmed | Effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach |
| title_short | Effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach |
| title_sort | effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach |
| url | http://journalarticle.ukm.my/16172/ http://journalarticle.ukm.my/16172/ http://journalarticle.ukm.my/16172/1/19.pdf |