Effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach
Hardness properties of SAC305 solder wire under tensile test at varied temperature was investigated. Continuous multicycle (CMC) nanoindentation technique with ten cycle of indentation for each sample was performed to evaluate the hardness behaviour of SAC305 solder wire at different depth of inden...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit Universiti Kebangsaan Malaysia
2020
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| Online Access: | http://journalarticle.ukm.my/16172/ http://journalarticle.ukm.my/16172/1/19.pdf |