Process and reliability of die attachment by time-reduced sintering of nanosilver film

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Process and reliability of die attachment by time-reduced sintering of nanosilver film

This study focused on the time-reduced sintering process of nanosilver film and power cycling reliability of the sintered die attachments. The aim is to demonstrate whether the time-reduced sintered joints formed within seconds have sufficient strength to survive the subsequent assembly processes su...

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Bibliographic Details
Main Author:	Dai, Jingru
Format:	Thesis (University of Nottingham only)
Language:	English
Published:	2019
Subjects:	nanosilver film; die attachments; sintering
Online Access:	https://eprints.nottingham.ac.uk/55795/

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