Process and reliability of die attachment by time-reduced sintering of nanosilver film
This study focused on the time-reduced sintering process of nanosilver film and power cycling reliability of the sintered die attachments. The aim is to demonstrate whether the time-reduced sintered joints formed within seconds have sufficient strength to survive the subsequent assembly processes su...
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| Format: | Thesis (University of Nottingham only) |
| Language: | English |
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2019
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| Online Access: | https://eprints.nottingham.ac.uk/55795/ |