APA (7th ed.) Citation

Dai, J. (2019). Process and reliability of die attachment by time-reduced sintering of nanosilver film.

Chicago Style (17th ed.) Citation

Dai, Jingru. Process and Reliability of Die Attachment by Time-reduced Sintering of Nanosilver Film. 2019.

MLA (9th ed.) Citation

Dai, Jingru. Process and Reliability of Die Attachment by Time-reduced Sintering of Nanosilver Film. 2019.

Warning: These citations may not always be 100% accurate.