Mechanical characterisation of adhesive bonds in MEMS inertial sensors

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Mechanical characterisation of adhesive bonds in MEMS inertial sensors

Micro-Electro-Mechanical Systems (MEMS) inertial sensors are used to measure acceleration and rate of angular rotation based on the deformation of a small sensitive structure, and are widely used from low-cost commercial to high-performance space and defence applications. Packaging processes can ind...

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Bibliographic Details
Main Author:	Kendall, Peter
Format:	Thesis (University of Nottingham only)
Language:	English
Published:	2018
Subjects:	Micro-Electro-Mechanical Systems (MEMS) inertial sensors; adhesive bonds
Online Access:	https://eprints.nottingham.ac.uk/55292/

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