Individual device active cooling for enhanced system-level power density and more uniform temperature distribution
This paper provides a method of individual device active cooling system to balance the temperature distribution of system-level power density. 3L-ANPC GaN inverter was used to test and prove the feasibility of it in using multi-level systems.
| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2018
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| Subjects: | |
| Online Access: | https://eprints.nottingham.ac.uk/54142/ |
| _version_ | 1848799018391437312 |
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| author | Zeng, Y. Hussein, A. Castellazzi, A. |
| author_facet | Zeng, Y. Hussein, A. Castellazzi, A. |
| author_sort | Zeng, Y. |
| building | Nottingham Research Data Repository |
| collection | Online Access |
| description | This paper provides a method of individual device active cooling system to balance the temperature distribution of system-level power density. 3L-ANPC GaN inverter was used to test and prove the feasibility of it in using multi-level systems. |
| first_indexed | 2025-11-14T20:28:59Z |
| format | Conference or Workshop Item |
| id | nottingham-54142 |
| institution | University of Nottingham Malaysia Campus |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T20:28:59Z |
| publishDate | 2018 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | nottingham-541422018-09-11T08:48:25Z https://eprints.nottingham.ac.uk/54142/ Individual device active cooling for enhanced system-level power density and more uniform temperature distribution Zeng, Y. Hussein, A. Castellazzi, A. This paper provides a method of individual device active cooling system to balance the temperature distribution of system-level power density. 3L-ANPC GaN inverter was used to test and prove the feasibility of it in using multi-level systems. 2018-06-25 Conference or Workshop Item PeerReviewed application/pdf en https://eprints.nottingham.ac.uk/54142/1/Individual%20device%20active%20cooling%20for%20enhanced%20system-level%20power%20density%20and%20more%20uniform%20temperature%20distribution.pdf Zeng, Y., Hussein, A. and Castellazzi, A. (2018) Individual device active cooling for enhanced system-level power density and more uniform temperature distribution. In: 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 13-17 May 2018, Chicago, USA. Individual active cooling system GaN HEMT 3LANPC inverter https://ieeexplore.ieee.org/document/8393705/ 10.1109/ispsd.2018.8393705 10.1109/ispsd.2018.8393705 10.1109/ispsd.2018.8393705 |
| spellingShingle | Individual active cooling system GaN HEMT 3LANPC inverter Zeng, Y. Hussein, A. Castellazzi, A. Individual device active cooling for enhanced system-level power density and more uniform temperature distribution |
| title | Individual device active cooling for enhanced system-level power density and more uniform temperature distribution |
| title_full | Individual device active cooling for enhanced system-level power density and more uniform temperature distribution |
| title_fullStr | Individual device active cooling for enhanced system-level power density and more uniform temperature distribution |
| title_full_unstemmed | Individual device active cooling for enhanced system-level power density and more uniform temperature distribution |
| title_short | Individual device active cooling for enhanced system-level power density and more uniform temperature distribution |
| title_sort | individual device active cooling for enhanced system-level power density and more uniform temperature distribution |
| topic | Individual active cooling system GaN HEMT 3LANPC inverter |
| url | https://eprints.nottingham.ac.uk/54142/ https://eprints.nottingham.ac.uk/54142/ https://eprints.nottingham.ac.uk/54142/ |