Cost effective direct-substrate jet impingement cooling concept for power application

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Cost effective direct-substrate jet impingement cooling concept for power application

Direct substrate jet impingement cooling can eliminate the use of the baseplate and significantly reduce the weight and volume of conventional thermal management solutions. This work demonstrates a cost-effective manufacturing approach based on printed circuit board technology to create impingement...

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Bibliographic Details
Main Authors:	Mouawad, Bassem, Abebe, Robert, Skuriat, Robert, Li, Jianfeng, De Lillo, Liliana, Empringham, Lee, Johnson, C. Mark, Roberts, Andy, Clarke, Robert, Haynes, Geoff
Format:	Conference or Workshop Item
Language:	English
Published:	2018
Online Access:	https://eprints.nottingham.ac.uk/53444/

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