Cost effective direct-substrate jet impingement cooling concept for power application
Direct substrate jet impingement cooling can eliminate the use of the baseplate and significantly reduce the weight and volume of conventional thermal management solutions. This work demonstrates a cost-effective manufacturing approach based on printed circuit board technology to create impingement...
| Main Authors: | , , , , , , , , , |
|---|---|
| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2018
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| Online Access: | https://eprints.nottingham.ac.uk/53444/ |