Cost effective direct-substrate jet impingement cooling concept for power application
Direct substrate jet impingement cooling can eliminate the use of the baseplate and significantly reduce the weight and volume of conventional thermal management solutions. This work demonstrates a cost-effective manufacturing approach based on printed circuit board technology to create impingement...
| Main Authors: | , , , , , , , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2018
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| Online Access: | https://eprints.nottingham.ac.uk/53444/ |
| _version_ | 1848798942706270208 |
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| author | Mouawad, Bassem Abebe, Robert Skuriat, Robert Li, Jianfeng De Lillo, Liliana Empringham, Lee Johnson, C. Mark Roberts, Andy Clarke, Robert Haynes, Geoff |
| author_facet | Mouawad, Bassem Abebe, Robert Skuriat, Robert Li, Jianfeng De Lillo, Liliana Empringham, Lee Johnson, C. Mark Roberts, Andy Clarke, Robert Haynes, Geoff |
| author_sort | Mouawad, Bassem |
| building | Nottingham Research Data Repository |
| collection | Online Access |
| description | Direct substrate jet impingement cooling can eliminate the use of the baseplate and significantly reduce the weight and volume of conventional thermal management solutions. This work demonstrates a cost-effective manufacturing approach based on printed circuit board technology to create impingement cells under a direct bonded copper substrate. Results from both computational fluid dynamics simulations and transient thermal tests verify the good performance of such jet impingement cooling systems under high power density conditions. Further work is ongoing to apply the present cooling and manufacturing technologies for the development of a range of high performance power electronic systems. |
| first_indexed | 2025-11-14T20:27:47Z |
| format | Conference or Workshop Item |
| id | nottingham-53444 |
| institution | University of Nottingham Malaysia Campus |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T20:27:47Z |
| publishDate | 2018 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | nottingham-534442018-08-23T12:18:03Z https://eprints.nottingham.ac.uk/53444/ Cost effective direct-substrate jet impingement cooling concept for power application Mouawad, Bassem Abebe, Robert Skuriat, Robert Li, Jianfeng De Lillo, Liliana Empringham, Lee Johnson, C. Mark Roberts, Andy Clarke, Robert Haynes, Geoff Direct substrate jet impingement cooling can eliminate the use of the baseplate and significantly reduce the weight and volume of conventional thermal management solutions. This work demonstrates a cost-effective manufacturing approach based on printed circuit board technology to create impingement cells under a direct bonded copper substrate. Results from both computational fluid dynamics simulations and transient thermal tests verify the good performance of such jet impingement cooling systems under high power density conditions. Further work is ongoing to apply the present cooling and manufacturing technologies for the development of a range of high performance power electronic systems. 2018-07-05 Conference or Workshop Item PeerReviewed application/pdf en https://eprints.nottingham.ac.uk/53444/1/Cost%20Effective%20Direct-Substrate%20Jet%20Impingement%20Cooling%20Concept%20for%20Power%20Application.pdf Mouawad, Bassem, Abebe, Robert, Skuriat, Robert, Li, Jianfeng, De Lillo, Liliana, Empringham, Lee, Johnson, C. Mark, Roberts, Andy, Clarke, Robert and Haynes, Geoff (2018) Cost effective direct-substrate jet impingement cooling concept for power application. In: PCIM 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 5-7 June 2018, Nuremberg, Germany. |
| spellingShingle | Mouawad, Bassem Abebe, Robert Skuriat, Robert Li, Jianfeng De Lillo, Liliana Empringham, Lee Johnson, C. Mark Roberts, Andy Clarke, Robert Haynes, Geoff Cost effective direct-substrate jet impingement cooling concept for power application |
| title | Cost effective direct-substrate jet impingement cooling concept for power application |
| title_full | Cost effective direct-substrate jet impingement cooling concept for power application |
| title_fullStr | Cost effective direct-substrate jet impingement cooling concept for power application |
| title_full_unstemmed | Cost effective direct-substrate jet impingement cooling concept for power application |
| title_short | Cost effective direct-substrate jet impingement cooling concept for power application |
| title_sort | cost effective direct-substrate jet impingement cooling concept for power application |
| url | https://eprints.nottingham.ac.uk/53444/ |