Co-design/simulation of flip-chip assembly for high voltage IGBT packages

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Co-design/simulation of flip-chip assembly for high voltage IGBT packages

This paper details a co-design and modelling methodology to optimise the flip-chip assembly parameters so that the overall package and system meets performance and reliability specifications for LED lighting applications. A co-design methodology is employed between device level modelling and package...

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Bibliographic Details
Main Authors:	Rajaguru, P., Bailey, Christopher, Aliyu, Attahir Murtala, Castellazzi, Alberto, Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitchelson, P.D., Elliot, A.D.T.
Format:	Conference or Workshop Item
Published:	2017
Online Access:	https://eprints.nottingham.ac.uk/51686/

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