Co-design/simulation of flip-chip assembly for high voltage IGBT packages
This paper details a co-design and modelling methodology to optimise the flip-chip assembly parameters so that the overall package and system meets performance and reliability specifications for LED lighting applications. A co-design methodology is employed between device level modelling and package...
| Main Authors: | , , , , , , , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2017
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| Online Access: | https://eprints.nottingham.ac.uk/51686/ |