Co-design/simulation of flip-chip assembly for high voltage IGBT packages
This paper details a co-design and modelling methodology to optimise the flip-chip assembly parameters so that the overall package and system meets performance and reliability specifications for LED lighting applications. A co-design methodology is employed between device level modelling and package...
Full description
Bibliographic Details
| Main Authors: |
Rajaguru, P.,
Bailey, Christopher,
Aliyu, Attahir Murtala,
Castellazzi, Alberto,
Pathirana, V.,
Udugampola, N.,
Trajkovic, T.,
Udrea, F.,
Mitchelson, P.D.,
Elliot, A.D.T. |
|---|
| Format: | Conference or Workshop Item
|
|---|
| Published: |
2017
|
|---|
| Online Access: | https://eprints.nottingham.ac.uk/51686/
|
|---|