Rajaguru, P., Bailey, C., Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., . . . Elliot, A. (2017). Co-design/simulation of flip-chip assembly for high voltage IGBT packages.
Chicago Style (17th ed.) CitationRajaguru, P., et al. Co-design/simulation of Flip-chip Assembly for High Voltage IGBT Packages. 2017.
MLA (9th ed.) CitationRajaguru, P., et al. Co-design/simulation of Flip-chip Assembly for High Voltage IGBT Packages. 2017.
Warning: These citations may not always be 100% accurate.