Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling

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Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling

13.5 mm × 13.5 mm sintered nano-silver attachments for power devices onto AlN substrates were prepared at 250 ºC and a pressure of 10MPa for 5 minutes and compared with Pb5Sn solder joint die attachments under constant current power cycling with an initial temperature swing of 50-175 ºC. Both the ef...

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Bibliographic Details
Main Authors:	Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin, Johnson, Christopher Mark
Format:	Article
Language:	English
Published:	Institute of Electrical and Electronics Engineers 2018
Subjects:	Sintered nanosilver joint high lead solder joint power cycling thermal impedance and microstructures
Online Access:	https://eprints.nottingham.ac.uk/51085/

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