Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling
13.5 mm × 13.5 mm sintered nano-silver attachments for power devices onto AlN substrates were prepared at 250 ºC and a pressure of 10MPa for 5 minutes and compared with Pb5Sn solder joint die attachments under constant current power cycling with an initial temperature swing of 50-175 ºC. Both the ef...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Institute of Electrical and Electronics Engineers
2018
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| Subjects: | |
| Online Access: | https://eprints.nottingham.ac.uk/51085/ |