Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling
13.5 mm × 13.5 mm sintered nano-silver attachments for power devices onto AlN substrates were prepared at 250 ºC and a pressure of 10MPa for 5 minutes and compared with Pb5Sn solder joint die attachments under constant current power cycling with an initial temperature swing of 50-175 ºC. Both the ef...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Institute of Electrical and Electronics Engineers
2018
|
| Subjects: | |
| Online Access: | https://eprints.nottingham.ac.uk/51085/ |
| _version_ | 1848798411782881280 |
|---|---|
| author | Dai, Jingru Li, Jianfeng Agyakwa, Pearl Corfield, Martin Johnson, Christopher Mark |
| author_facet | Dai, Jingru Li, Jianfeng Agyakwa, Pearl Corfield, Martin Johnson, Christopher Mark |
| author_sort | Dai, Jingru |
| building | Nottingham Research Data Repository |
| collection | Online Access |
| description | 13.5 mm × 13.5 mm sintered nano-silver attachments for power devices onto AlN substrates were prepared at 250 ºC and a pressure of 10MPa for 5 minutes and compared with Pb5Sn solder joint die attachments under constant current power cycling with an initial temperature swing of 50-175 ºC. Both the effective thermal resistance and microstructural evolution of the samples were monitored using transient thermal impedance measurement and non-destructive X-ray computed tomography at regular power cycling intervals. The results showed a gradual increase in the effective thermal resistance of the Pb5Sn solder joints from 0.047 to 0.133 K/W from zero to 41k power cycles, followed by a rapid escalation to 0.5018 K/W at 52k cycles. This was accompanied with the formation and development of oblique cracks within the Pb5Sn die attachments until delamination occurred at the solder/device and solder/substrate interfaces. By contrast, the effective thermal resistance of the sintered Ag joints remained almost constant at 0.040 K/W up to 116k power cycles. This was explained in terms of thermally induced continuation of densification of the sintered structure and the formation and development of networked vertical cracks within the sintered Ag die attachments, some of which further extended into the Cu tracks of the AlN substrate. |
| first_indexed | 2025-11-14T20:19:21Z |
| format | Article |
| id | nottingham-51085 |
| institution | University of Nottingham Malaysia Campus |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T20:19:21Z |
| publishDate | 2018 |
| publisher | Institute of Electrical and Electronics Engineers |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | nottingham-510852020-05-08T09:15:30Z https://eprints.nottingham.ac.uk/51085/ Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling Dai, Jingru Li, Jianfeng Agyakwa, Pearl Corfield, Martin Johnson, Christopher Mark 13.5 mm × 13.5 mm sintered nano-silver attachments for power devices onto AlN substrates were prepared at 250 ºC and a pressure of 10MPa for 5 minutes and compared with Pb5Sn solder joint die attachments under constant current power cycling with an initial temperature swing of 50-175 ºC. Both the effective thermal resistance and microstructural evolution of the samples were monitored using transient thermal impedance measurement and non-destructive X-ray computed tomography at regular power cycling intervals. The results showed a gradual increase in the effective thermal resistance of the Pb5Sn solder joints from 0.047 to 0.133 K/W from zero to 41k power cycles, followed by a rapid escalation to 0.5018 K/W at 52k cycles. This was accompanied with the formation and development of oblique cracks within the Pb5Sn die attachments until delamination occurred at the solder/device and solder/substrate interfaces. By contrast, the effective thermal resistance of the sintered Ag joints remained almost constant at 0.040 K/W up to 116k power cycles. This was explained in terms of thermally induced continuation of densification of the sintered structure and the formation and development of networked vertical cracks within the sintered Ag die attachments, some of which further extended into the Cu tracks of the AlN substrate. Institute of Electrical and Electronics Engineers 2018-04-03 Article PeerReviewed application/pdf en https://eprints.nottingham.ac.uk/51085/1/Comparative%20Thermal%20and%20Structural%20Characterization%20of%20Sintered%20Nano-Silver%20and%20High-Lead%20Solder%20Die%20Attachments%20during%20Power%20Cycling%20%28002%29.pdf Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin and Johnson, Christopher Mark (2018) Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling. IEEE Transactions on Device and Materials Reliability . ISSN 1530-4388 (In Press) Sintered nanosilver joint high lead solder joint power cycling thermal impedance and microstructures |
| spellingShingle | Sintered nanosilver joint high lead solder joint power cycling thermal impedance and microstructures Dai, Jingru Li, Jianfeng Agyakwa, Pearl Corfield, Martin Johnson, Christopher Mark Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling |
| title | Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling |
| title_full | Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling |
| title_fullStr | Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling |
| title_full_unstemmed | Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling |
| title_short | Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling |
| title_sort | comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling |
| topic | Sintered nanosilver joint high lead solder joint power cycling thermal impedance and microstructures |
| url | https://eprints.nottingham.ac.uk/51085/ |