APA (7th ed.) Citation

Dai, J., Li, J., Agyakwa, P., Corfield, M., & Johnson, C. M. (2018). Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling. Institute of Electrical and Electronics Engineers.

Chicago Style (17th ed.) Citation

Dai, Jingru, Jianfeng Li, Pearl Agyakwa, Martin Corfield, and Christopher Mark Johnson. Comparative Thermal and Structural Characterization of Sintered Nano-silver and High-lead Solder Die Attachments During Power Cycling. Institute of Electrical and Electronics Engineers, 2018.

MLA (9th ed.) Citation

Dai, Jingru, et al. Comparative Thermal and Structural Characterization of Sintered Nano-silver and High-lead Solder Die Attachments During Power Cycling. Institute of Electrical and Electronics Engineers, 2018.