APA (7th ed.) Citation

Li, J., Dai, J., & Johnson, C. M. (2018). Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints. Elsevier.

Chicago Style (17th ed.) Citation

Li, Jianfeng, Jingru Dai, and Christopher Mark Johnson. Comparison of Power Cycling Reliability of Flexible PCB Interconnect Smaller/thinner and Larger/thicker Power Devices with Topside Sn-3.5Ag Solder Joints. Elsevier, 2018.

MLA (9th ed.) Citation

Li, Jianfeng, et al. Comparison of Power Cycling Reliability of Flexible PCB Interconnect Smaller/thinner and Larger/thicker Power Devices with Topside Sn-3.5Ag Solder Joints. Elsevier, 2018.