Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints

Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints

The power cycling reliability of flexible printed circuit board (PCB) interconnect smaller/thinner (ST) 9.5 mm × 5.5 mm × 0.07 mm and larger/thicker (LT) 13.5 mm × 13.5 mm × 0.5 mm single Si diode samples have been studied. With the assumption of creep strain accumulation-induced fatigue cracking as...

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Bibliographic Details
Main Authors: Li, Jianfeng, Dai, Jingru, Johnson, Christopher Mark
Format: Article
Published: Elsevier 2018
Subjects:
Reliability; Planar interconnect; Power semiconductor; Finite element method; Power cycling; Sn-3.5Ag solder alloy; Scanning electronic microscopy
Online Access:https://eprints.nottingham.ac.uk/50733/

Internet

https://eprints.nottingham.ac.uk/50733/

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