Laser drilling of microholes in single crystal silicon using continuous wave (CW) 1070 nm fiber lasers with millisecond pulse widths

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Laser drilling of microholes in single crystal silicon using continuous wave (CW) 1070 nm fiber lasers with millisecond pulse widths

The laser microdrilling of via holes in Si semiconductor wafers was studied using 1 ms pulses from an Yb fibre laser with 1070 nm wavelength. Optical microscopy and cross‑sectional analysis were used to quantify hole dimensions, the distribution of recast material and any microcracking for both (100...

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Bibliographic Details
Main Authors:	Maclean, Jessica O., Hodson, J.R., Tangkijcharoenchai, C., Al-Ojaili, S., Rodsavas, S., Coomber, S., Voisey, K.T.
Format:	Article
Language:	English English English
Published:	Old City Publishing 2018
Subjects:	Fiber laser Ytterbium fiber laser silicon Si semiconductor material semiconductor wafer laser drilling percussion drilling microcrack pulse Griffith criterion via hole thru hole cold atoms
Online Access:	https://eprints.nottingham.ac.uk/49169/

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