Laser drilling of microholes in single crystal silicon using continuous wave (CW) 1070 nm fiber lasers with millisecond pulse widths

Laser drilling of microholes in single crystal silicon using continuous wave (CW) 1070 nm fiber lasers with millisecond pulse widths

The laser microdrilling of via holes in Si semiconductor wafers was studied using 1 ms pulses from an Yb fibre laser with 1070 nm wavelength. Optical microscopy and cross‑sectional analysis were used to quantify hole dimensions, the distribution of recast material and any microcracking for both (100...

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Bibliographic Details
Main Authors: Maclean, Jessica O., Hodson, J.R., Tangkijcharoenchai, C., Al-Ojaili, S., Rodsavas, S., Coomber, S., Voisey, K.T.
Format: Article
Language:English
English
English
Published: Old City Publishing 2018
Subjects:
Fiber laser
Ytterbium fiber laser
silicon
Si
semiconductor material
semiconductor wafer
laser drilling
percussion drilling
microcrack
pulse
Griffith criterion
via hole
thru hole
cold atoms
Online Access:https://eprints.nottingham.ac.uk/49169/

Internet

https://eprints.nottingham.ac.uk/49169/

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