Improved reliability of planar power interconnect with ceramic-based structure

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Improved reliability of planar power interconnect with ceramic-based structure

This paper proposes an advanced Si3N4 ceramic-based structure with through vias designed and filled with brazing alloy as a reliable interconnect solution in planar power modules. Finite element (FE) modeling and simulation were first used to predict the potential of using the proposed Si3N4 ceramic...

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Bibliographic Details
Main Authors:	Zhang, Hui, Li, Jianfeng, Dai, Jingru, Corfield, Martin, Liu, Xuejian, Liu, Yan, Huang, Zhengren, Johnson, Christopher Mark
Format:	Article
Published:	IEEE 2018
Subjects:	Materials reliability electronics packaging planar power module finite element method power cycling X-ray computation tomography
Online Access:	https://eprints.nottingham.ac.uk/46782/

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