Improved reliability of planar power interconnect with ceramic-based structure
This paper proposes an advanced Si3N4 ceramic-based structure with through vias designed and filled with brazing alloy as a reliable interconnect solution in planar power modules. Finite element (FE) modeling and simulation were first used to predict the potential of using the proposed Si3N4 ceramic...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Published: |
IEEE
2018
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| Subjects: | |
| Online Access: | https://eprints.nottingham.ac.uk/46782/ |