APA (7th ed.) Citation

Zhang, H., Li, J., Dai, J., Corfield, M., Liu, X., Liu, Y., . . . Johnson, C. M. (2018). Improved reliability of planar power interconnect with ceramic-based structure. IEEE.

Chicago Style (17th ed.) Citation

Zhang, Hui, Jianfeng Li, Jingru Dai, Martin Corfield, Xuejian Liu, Yan Liu, Zhengren Huang, and Christopher Mark Johnson. Improved Reliability of Planar Power Interconnect with Ceramic-based Structure. IEEE, 2018.

MLA (9th ed.) Citation

Zhang, Hui, et al. Improved Reliability of Planar Power Interconnect with Ceramic-based Structure. IEEE, 2018.