Evaluation of SiC Schottky diodes using pressure contacts
The thermomechanical reliability of SiC power devices and modules is increasingly becoming of interest especially for high power applications where power cycling performance is critical. Press-pack assemblies are a trusted and reliable packaging solution that has traditionally been used for high pow...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Published: |
Institute of Electrical and Electronics Engineers
2017
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| Subjects: | |
| Online Access: | https://eprints.nottingham.ac.uk/44371/ |