Packaging/assembling technologies for a high performance SiC-based planar power module
This work is to investigate the relevant packaging / assembling technologies for developing a SiC-based planar power module which is aimed to meet the requirements such as operating temperature of -60 °C to 200 °C, SiC devices connected to 540 V DC bus and non-hermetic module. The results reported i...
| Main Authors: | , , , , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2014
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| Online Access: | https://eprints.nottingham.ac.uk/44168/ |
| _version_ | 1848796853079900160 |
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| author | Li, Jianfeng Agyakwa, Pearl Evans, Paul Johnson, Christopher Mark Zhao, Yimin Wu, Yibo Evans, Kim |
| author_facet | Li, Jianfeng Agyakwa, Pearl Evans, Paul Johnson, Christopher Mark Zhao, Yimin Wu, Yibo Evans, Kim |
| author_sort | Li, Jianfeng |
| building | Nottingham Research Data Repository |
| collection | Online Access |
| description | This work is to investigate the relevant packaging / assembling technologies for developing a SiC-based planar power module which is aimed to meet the requirements such as operating temperature of -60 °C to 200 °C, SiC devices connected to 540 V DC bus and non-hermetic module. The results reported in this paper include: (i) design of a compact wire-less SiC-based power module with low parasitic inductance; (ii) demonstrated feasibility and reliability for the sintering of Ag nanoparticles and flexible printed circuit board as alternative joining and interconnect technologies which have been selected to assemble the designed power module; and (iii) preliminary construction of the designed module and electrical switching test of the constructed module. |
| first_indexed | 2025-11-14T19:54:34Z |
| format | Conference or Workshop Item |
| id | nottingham-44168 |
| institution | University of Nottingham Malaysia Campus |
| institution_category | Local University |
| last_indexed | 2025-11-14T19:54:34Z |
| publishDate | 2014 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | nottingham-441682020-05-04T16:43:17Z https://eprints.nottingham.ac.uk/44168/ Packaging/assembling technologies for a high performance SiC-based planar power module Li, Jianfeng Agyakwa, Pearl Evans, Paul Johnson, Christopher Mark Zhao, Yimin Wu, Yibo Evans, Kim This work is to investigate the relevant packaging / assembling technologies for developing a SiC-based planar power module which is aimed to meet the requirements such as operating temperature of -60 °C to 200 °C, SiC devices connected to 540 V DC bus and non-hermetic module. The results reported in this paper include: (i) design of a compact wire-less SiC-based power module with low parasitic inductance; (ii) demonstrated feasibility and reliability for the sintering of Ag nanoparticles and flexible printed circuit board as alternative joining and interconnect technologies which have been selected to assemble the designed power module; and (iii) preliminary construction of the designed module and electrical switching test of the constructed module. 2014-02-07 Conference or Workshop Item PeerReviewed Li, Jianfeng, Agyakwa, Pearl, Evans, Paul, Johnson, Christopher Mark, Zhao, Yimin, Wu, Yibo and Evans, Kim (2014) Packaging/assembling technologies for a high performance SiC-based planar power module. In: Greener Aviation Conference 2014: Clean Sky Breakthrough and Worldwide Status, 12-14 March 2014, Brussels, Belgium. |
| spellingShingle | Li, Jianfeng Agyakwa, Pearl Evans, Paul Johnson, Christopher Mark Zhao, Yimin Wu, Yibo Evans, Kim Packaging/assembling technologies for a high performance SiC-based planar power module |
| title | Packaging/assembling technologies for a high performance SiC-based planar power module |
| title_full | Packaging/assembling technologies for a high performance SiC-based planar power module |
| title_fullStr | Packaging/assembling technologies for a high performance SiC-based planar power module |
| title_full_unstemmed | Packaging/assembling technologies for a high performance SiC-based planar power module |
| title_short | Packaging/assembling technologies for a high performance SiC-based planar power module |
| title_sort | packaging/assembling technologies for a high performance sic-based planar power module |
| url | https://eprints.nottingham.ac.uk/44168/ |