Packaging/assembling technologies for a high performance SiC-based planar power module
This work is to investigate the relevant packaging / assembling technologies for developing a SiC-based planar power module which is aimed to meet the requirements such as operating temperature of -60 °C to 200 °C, SiC devices connected to 540 V DC bus and non-hermetic module. The results reported i...
| Main Authors: | , , , , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2014
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| Online Access: | https://eprints.nottingham.ac.uk/44168/ |